Semiconductor refrigeration film was originally developed by the former Soviet Union's military project. Its real name is semiconductor refrigeration film, but not semiconductor refrigeration chip. Because its "Zhi" and "making" are homonymous, because most people are used to calling it refrigeration film, it has English name Peltier, and some people call it thermoelectric chip, It is mainly composed of p-type and n-type semiconductor wafers. Several stacks are connected in series and then synthesized by metallized porcelain. At present, the main functions are cooling and heating (when using electricity), and generating electricity (when temperature difference).
The cooling efficiency of semiconductor refrigeration chip is very low, about 30% of the total power consumption. However, the heating rate is very high, which is about 130% of the total power consumption. However, it still has many advantages, such as silence, fire prevention, and high temperature resistance. Small size, vibration resistance, long life. So it is widely used in various fields.
For first-time users, choosing the model is the first thing to do. To select the model, first determine the voltage that can be taken, for example, DC 12V. Then you can select the tec1-127 series semiconductor refrigeration chip, and then determine the current. Generally, the larger the current power, the more stringent the dispersion requirements. Therefore, in order to meet the requirements of refrigeration, low-power semiconductor refrigeration chip, such as tec1-127024040, should be used as soon as possible. In this way, it is easy to do heat dissipation design and save power.
Because the degree of cooling of semiconductor cooling chip is related to many factors, such as voltage, current, heat dissipation design, thermal conductive silicone grease, and ambient temperature, many experiments need to be done when the product is developed. When the parameter values of all parties reach a balanced value, the experiment is completed and the first sample can be made, so as to guide the subsequent mass production.
Some misunderstandings and key points in the use of semiconductor refrigeration chips are shared by colleagues from aoling cryochip technology department
1. It is not that the higher the thermal power of the semiconductor cooling chip is, the better the cold design of its own product is. However, when it can meet the thermal design requirements, the higher the power, the better the product. If the cooling requirements can be met, the low-power semiconductor refrigeration chip should be selected as far as possible.
2. When assembling the semiconductor cooling sheet, the rigid locking structure should not be adopted, but the flexible locking structure should be adopted, such as the CPU radiator device of a computer.
3. After power on, the closer the heat sink temperature is to the ambient temperature (usually no more than 3 ~ 5 ℃), the better the thermal design is. The temperature of the cold end is low.
4. The thermal conductive silicone grease should be the specification with high thermal conductivity and good dry resistance
5. Dew protection measures: as long as the cold parts are not lower than the ambient temperature of about 5 degrees centigrade, they will not condense. If the cold parts cannot avoid being lower than 5 degrees Celsius of the ambient temperature, they should be sealed with vacuum cotton or insulation materials to isolate them from the outside.
